Teams at Arm

Designs, verifies, and optimizes 2.5D and 3D system-in-package layouts for next-generation SoCs. Responsibilities include package routing, bump-map and ball-pattern optimization, stack-up and power-distribution design, feasibility studies, DFM/DFA implementation, vendor coordination, methodology development, and mentoring team members using Cadence APD and SiP tools.

Coordinates electronic prototype and PCB new product introductions from design readiness through manufacturing and testing. Works with engineering, procurement, suppliers, and contract manufacturers to ensure materials, tooling, documentation, test strategies, and schedules are aligned. Supports DFM/DFA reviews, drives build issue resolution and root-cause analysis, maintains NPI documentation, manages supplier and manufacturing risks, and improves build quality and readiness. Travel to manufacturing locations may be required.

Provide strategic legal support for high-value commercial transactions in the semiconductor and hardware business. Draft and negotiate master purchase agreements, strategic partnerships, customer deals, NDAs, and EULAs. Advise sales, executives, and business teams on deal risk, supply commitments, pricing, allocation, delivery, liability, indemnification, warranties, IP, and licensing. Develop scalable legal processes and playbooks, mentor commercial lawyers, and negotiate with hyperscale cloud and enterprise customers.