Teams at Boeing

Designs, develops, tests, and supports printed circuit boards for electronic products. Responsibilities include PCB layout, stack-up specification, component selection, signal and power integrity analysis, design reviews, manufacturability assessment, documentation, board bring-up, debugging, testing, and sustaining engineering. The role collaborates with leadership and cross-functional stakeholders on requirements, schedules, and program execution.

Leads microelectronic packaging projects supporting ARM-based SoC development, including 3D advanced packaging. Coordinates cross-functional engineering teams and suppliers, manages statements of work, trade studies, source selection, risks, resources, schedules, costs, performance metrics, and technical reviews throughout the program lifecycle. Ensures alignment between technical and business objectives and supports successful processor packaging delivery.

Provides sustaining process engineering support for semiconductor solar cell wafer and assembly production. Maintains process control using SPC, troubleshoots equipment and manufacturing anomalies, and drives improvements to reduce cycle time and cost while improving product performance. Supports solar technology R&D, process and product development, material characterization, safety initiatives, and cross-functional Operations objectives. This is a 100% onsite, second-shift role requiring U.S. Person status and the ability to obtain a Secret clearance.