Jobs at FormFactor, Inc.

Leads strategic semiconductor customer engagements from technology evaluation through qualification, production release, and high-volume manufacturing. Serves as a technical authority in wafer probing, semiconductor test, and device characterization; resolves complex escalations, develops application methodologies, supports advanced technologies, influences product roadmaps, and mentors applications engineers. Partners cross-functionally with Engineering, Product Management, Sales, Service, and Manufacturing to improve yield, throughput, measurement accuracy, and customer adoption.

Leads strategic semiconductor customer engagements from technology evaluation through qualification, production release, and high-volume manufacturing. Serves as a technical authority in wafer probing, semiconductor test, and device characterization; resolves complex escalations, develops application methodologies, supports advanced photonics and packaging technologies, and influences product roadmaps. Partners with Engineering, Product Management, Sales, Service, and Manufacturing while mentoring technical teams and improving customer yield, throughput, measurement accuracy, and production productivity.

Responsible for designing and developing control software for precision manufacturing machines, involving C#/C++ programming, automation technologies, and collaboration with engineers.

Develops, characterizes, optimizes, and scales manufacturing processes from R&D through production. Responsibilities include DOE, statistical analysis, SPC, process qualification, NPI support, process transfers, equipment and supplier collaboration, troubleshooting, documentation, training, and continuous improvement. The role works cross-functionally to improve yield, quality, throughput, reliability, manufacturability, and cost for semiconductor-related products and technologies.

Leads complex PCB and package substrate design, layout, routing, verification, and release for semiconductor test and measurement products. Applies high-speed, RF, analog, mixed-signal, signal integrity, and power integrity expertise. Establishes design standards, libraries, workflows, and automation requirements while improving manufacturability and development efficiency. Collaborates with electrical, mechanical, manufacturing, applications, product engineering, and external fabrication teams. Provides technical leadership, mentors designers, leads complex projects, and resolves challenging design issues.

Leads troubleshooting, repair, maintenance, and continuous improvement of probe cards and micro-assembly processes. Supports new product introduction, equipment and tooling customization, metrology, alignment verification, process transfers, and high-volume manufacturing documentation. Manages equipment upgrades, capacity expansion, and capital projects while coaching technicians and conducting operator training and certification.

Leads complex semiconductor technology and product development programs from concept through qualification, manufacturing readiness, and high-volume production. Owns scope, schedules, resources, dependencies, risks, milestones, governance, and executive reporting. Coordinates engineering, manufacturing, quality, supply chain, operations, product management, and customer-facing teams. Drives NPI, qualification, commercialization, yield improvement, reliability, issue resolution, and continuous improvement while aligning technical execution with business objectives.

Develop, qualify, implement, and sustain tight-pitch semiconductor manufacturing processes. Lead product conversions, optimize yield and cycle time, establish SPC controls, analyze manufacturing data, implement corrective actions, maintain engineering documentation, support equipment qualification and production ramp, train technicians, and collaborate with manufacturing, quality, product engineering, and wafer engineering teams on troubleshooting and continuous improvement.

Lead and develop a team of manufacturing technicians in a semiconductor fab to execute production schedules, meet throughput and quality goals, enforce cleanroom and safety protocols, drive continuous improvement using Lean/Six Sigma, and coordinate cross‑functional production issue resolution.

Provide expert-level technical support and failure analysis for probe card products in production, drive root-cause investigations using ATE, microscopy and electrical measurements, collaborate with engineering and manufacturing on corrective actions, support NPI and onsite customer troubleshooting, and analyze wafer test data to produce technical reports and optimize yield.

Owns short-, mid-, and long-range wafer fab production plans and finite-capacity schedules. Balances demand, capacity, WIP, yield, cycle time, materials, and equipment constraints while managing scenarios, recovery priorities, NPI ramps, and technology transfers. Leads planning reviews, governs master data, develops dashboards, improves planning accuracy, and coordinates cross-functional decisions across Manufacturing, Engineering, Supply Chain, Quality, and business planning teams.

Lead development and delivery of advanced cooling solutions for probe card technologies. Define thermal strategy and roadmap, manage and scale engineering teams, drive product development using PLC methodology, coordinate cross-functional prototyping and manufacturing, resolve critical product issues, and deliver program outcomes for schedule, cost, and technical performance.

Lead R&D and implementation of advanced electroplating and metallurgical processes for MEMS probe fabrication. Define technology roadmaps, design and execute DOE, develop and scale electrodeposition processes, perform materials characterization and failure analysis (SEM, EDS, FIB), drive process control and yield improvements, generate IP, and mentor engineering teams while collaborating cross-functionally to commercialize next-generation probe technologies.

Lead development and implementation of advanced MEMS photolithography processes, drive innovation and IP, perform DOE and statistical process characterization, lead failure analysis using SEM/FIB, collaborate cross-functionally, and mentor engineering teams to enable next-generation probe card technologies and manufacturing-ready solutions.

Lead and develop a team of manufacturing technicians in a high‑precision semiconductor fab. Execute production schedules, meet throughput and quality goals, enforce cleanroom and EHS protocols, drive continuous improvement using Lean/Six Sigma, coordinate cross‑functional issue resolution, and manage hiring, training, and performance for assigned shifts.

Lead and develop a team of manufacturing technicians in a semiconductor fab to meet throughput, quality, cost, and cycle‑time targets. Manage daily production schedules, KPIs, safety, ISO/EHS compliance, continuous improvement (Lean/Six Sigma), hiring, training, and cross‑functional coordination to resolve production issues and improve yield.

Own and evolve finite capacity planning across assembly, test, and sub-fab support. Translate SIOP/MPS into resource-constrained production plans, run multi-scenario modeling, identify and resolve bottlenecks, support NPI/ramps, maintain capacity-critical master data, develop decision-grade analytics, and lead cross-functional execution to optimize throughput and service.

Improve SI/PI performance through measurement, characterization, and production design analysis. Perform lab measurements, correlate to simulations, model and design PDN and high-density I/O for PCBs, packages, connectors, and probe cards. Provide documentation, design constraints, and training to the Design Organization to shorten cycle time and improve product quality.

The Sr Staff Mechanical Design Engineer leads the development of innovative mechanical design solutions, mentors engineers, and collaborates across teams to solve complex problems while driving performance and reliability.

Lead enterprise Quality Management System (QMS) governance across global sites, driving compliance (ISO/IATF), audits, CAPA, change control, eQMS ownership, and continuous improvement. Partner with cross-functional teams to implement quality metrics, training, problem-solving, and customer audit readiness to improve quality performance and operational excellence.