Teams at Headway Technologies, Inc.

Performs FIB/SEM-based physical characterization, device cross-section imaging, metrology, materials and failure analysis, 3D tomography, and TEM lamella preparation. Analyzes complex data, develops sample-preparation recipes and characterization techniques, investigates process and materials issues, prepares reports, and presents findings supporting magnetic recording heads, MRAM, and other device technologies.

Evaluates head and media component reliability and performance under environmental and operational conditions. Develops test algorithms, conducts HDI testing, performs metrology and failure analysis, designs test fixtures, troubleshoots equipment, prepares samples through soldering, and reports findings. The role requires laboratory work, collaboration across departments, safety compliance, and occasional work in an ESD-sensitive wafer fabrication facility.

Supports and sustains wafer manufacturing processes by monitoring process controls, correcting errors, integrating new programs, evaluating transferred products, and conducting experiments for yield improvement. Analyzes defect data from FIB, SEM, EDX, and TEM tools, uses SPC and complex software to identify trends, performs root-cause analysis, recommends corrective actions, and prepares reports. The role operates in office and cleanroom manufacturing environments with exposure to chemicals, gases, noise, and occasional lifting.