Teams at Microsoft

Leads physical verification CAD methodology and signoff flows for advanced-node silicon programs. Develops and supports DRC, LVS, ERC, antenna, ESD, PERC, and related checks from early design through final signoff. Partners with physical design teams, CAD, technology groups, foundries, and EDA vendors to resolve complex issues, improve scalability, enable PDKs and nodes, and drive production-ready workflows. Also develops AI-enabled automation, documentation, training, and debug infrastructure.

Leads and grows an applied science team improving Outlook’s AI experiences. Defines quality metrics, builds large-scale evaluation systems, diagnoses production failures, and connects offline evaluation to online user outcomes. Partners with product and engineering leaders on model, prompt, tool, data, and system improvements, while guiding post-training strategies for frontier and open-source models and mentoring senior scientists.

Lead development and delivery of physical design tool flows, methodologies, and sign-off for block, sub-chip, and full-chip levels of Microsoft Next‑Gen AI SoC. Responsibilities include PnR convergence, STA and timing ECOs, PV and FEV sign-off, global clocking, EM/IR analysis, IP collateral validation, design reviews, and mentoring junior engineers.