Teams at Nokia

Lead PIC production test capacity, infrastructure, and ramp activities while managing test engineers and technicians. Responsibilities include hiring, onboarding, mentoring, resource prioritization, cross-functional collaboration with wafer fabs and operations, and development of production test hardware, software, and procedures. The role also oversees testability requirements, new product introduction testing, efficiency improvements, and engineering changes for photonic integrated circuit products.

Design and develop high-speed photonic integrated circuit devices. Perform RF and electro-optical simulations (HFSS, ADS), execute electrical/optical s-parameter testing, create designed experiments, analyze large datasets, and collaborate with fab, test, reliability, packaging, system, and product engineering to ensure device performance and reliability.

Lead architecture, design, fabrication, testing, and optimization of silicon photonics integrated circuits for coherent long-haul, metro, and pluggable optical systems. Drive PIC specification, link-budget analysis, DFM/DFT practices, cross-functional execution with RFIC/DSP/packaging/foundry partners, and establish simulation and test infrastructures for scalable, high-yield production.