Jobs at Texas Instruments

Design engineering intern supporting analog, digital, and RF integrated circuit development. Responsibilities include defining specifications, analyzing architecture trade-offs, participating in design reviews, supervising layouts, characterizing prototypes, developing test specifications, coordinating product releases, and creating behavioral models. The role requires pursuing an electrical or computer engineering degree and maintaining a minimum 3.0 GPA.

Design and model analog, digital, and RF integrated circuits; analyze chip architecture trade-offs; participate in design reviews; supervise IC layouts; characterize prototypes; develop test specifications; coordinate with test and product engineering; and drive behavioral models and product documentation.

Design and verify digital ICs by developing specifications, analyzing chip architecture trade-offs, participating in design reviews, supporting IC layouts, characterizing prototypes, developing test specifications, coordinating product releases, and creating behavioral models and documentation. The intern collaborates with business, system engineering, test, and product engineering teams across semiconductor product areas.

Lead customer support, product characterization, high-speed electro-optical test setup development, measurement automation, and data analysis for optical ICs and silicon photonics products. The role coordinates testing across global sites, manages equipment and vendors, supports customer design-ins, presents results, and supervises junior applications engineers.

Defines and develops custom power-management products and platforms, identifies strategic projects, analyzes market and technology trends, engages customers, and translates requirements into technical specifications. The role collaborates across marketing, applications, design, and manufacturing teams; supports silicon evaluation and debugging; develops datasheets and application notes; and contributes to product strategy, roadmap, and system-level power solutions.

Supports semiconductor product and test engineering across product development, qualification, manufacturing, cost optimization, yield enhancement, and quality. Responsibilities include troubleshooting, creating test specifications and documentation, designing and debugging test hardware and software, developing measurement circuits, resolving customer quality issues, and collaborating with design, test, quality, and other cross-functional teams.

Verifies analog and mixed-signal semiconductor designs before mask development through design-rule reviews, simulations, experimental testing, coverage analysis, and formal verification. Develops scalable UVM testbenches, drives functional and code coverage, reviews code and testbenches, evaluates vendor capabilities, supports methodology improvements, collaborates with stakeholders, and mentors junior engineers.

Develop and lead RF, SerDes, and mm-wave integrated circuits from architecture and simulation through silicon validation. Responsibilities include RF and analog IP design, layout guidance, characterization strategy, PCB development, RF and system-level measurements, competitive benchmarking, technology collaboration, productization, and university research liaison activities.

Verify analog and mixed-signal semiconductor designs before mask development by creating verification plans, building test benches, running simulations, analyzing experimental results, and confirming specification compliance. The role collaborates with design, systems, characterization, test, product, and customer teams; improves verification methodologies and pre-production processes; reviews design-for-verification architecture; and supports successful custom power semiconductor product execution.

Defines semiconductor products and roadmaps for TI’s low-voltage amplifiers and comparators product line. Responsibilities include translating customer needs into technical specifications, developing business cases, driving product development and ramp-up, supporting sales and applications teams, resolving system-level customer issues, assessing competitors, creating technical documentation, and coordinating cross-functional design, test, packaging, marketing, and sales activities.

Develop and execute mixed-signal verification strategies for battery management and charger devices. Responsibilities include creating analog behavioral models, building schematic/model/RTL testbenches, implementing checkers and assertions, running RTL and gate-level simulations, tracking coverage through tape-out, and debugging issues with digital, analog, and post-silicon validation teams.

Designs high-speed mixed-signal communication circuits and digital circuits interfacing with analog components. Responsibilities include RTL coding, simulation, synthesis, timing closure, verification, evaluation, debugging, test-method development, technical documentation, and demo-board support. Collaborates with analog and digital design teams to solve complex problems and deliver semiconductor projects on schedule.

Leads analog IC design projects for battery-charging applications from product definition through manufacturing release. Responsibilities include circuit design, silicon evaluation, physical design guidance, design verification collaboration, product documentation, customer support, roadmap development, and production transfer with validation and engineering teams.

Participates in TI’s Career Accelerator Program while developing expertise in product, test, or validation engineering. Responsibilities include supporting semiconductor product development, testing, qualification, debugging, cost reduction, yield enhancement, customer quality resolution, and cross-functional problem solving. The role involves hardware and software development, automated test equipment, bench characterization, data analysis, manufacturing support, and collaboration with fabrication and assembly sites.

Develop verification plans, test benches, tests, and simulations at RTL and GLS levels. Run coverage regressions, track verification status and issues, communicate progress, develop regression scripts, and improve design verification tools, methods, and workflows. Collaborate with design and systems teams to support first-pass silicon success while gaining exposure to digital and analog design.

Participate in an eight-month technical sales training program with rotations across field sales, mass market, and business unit engineering and marketing. Build customer relationships, identify and manage opportunities, support scalable sales processes, quantify leads, manage commercial relationships, and develop revenue growth plans. Successful participants advance to Technical Sales Representative roles within TI’s Worldwide Sales and Applications team.

Design, architect, and verify digital cores for battery charger ICs. Collaborate with systems and analog teams, create verification plans and simulation models, perform simulations and lab evaluations, support multiple projects, and improve design methodology and documentation.

Provide application support for clock and timing devices: answer customer questions, perform schematic/layout reviews, debug customer issues, design and release EVMs, run bench characterization and automation, participate in datasheet review, support new-silicon testing, and create reference designs and application notes.

Create, manage, and verify analog integrated circuit layouts from schematics using CAD tools. Floorplan and implement layouts, ensure compliance with manufacturing rules, perform DRC and ERC checks, support design reviews, prepare data for fab handoff, and collaborate with design, packaging, and process engineering teams. The role also involves documentation, layout automation, and optimizing designs for precision, area, reliability, power, speed, and ESD requirements.

Develops innovative RF, SerDes, and mm-wave integrated circuits and systems from architecture through silicon validation. Responsibilities include circuit design and simulation, RF and system characterization, electromagnetic modeling, PCB development, competitive benchmarking, technology transfer, and collaboration with process, packaging, business-unit, customer, and university research partners.