Leads the hardware engineering organization responsible for architecture, design, validation, bring-up, characterization, and production readiness of high-speed board-level hardware and interconnect solutions. Builds and mentors multidisciplinary hardware, SI/PI, and systems engineering teams; establishes design and simulation methodologies; manages budgets, schedules, risks, vendors, and production release. Partners with IC design, validation, applications, marketing, operations, customers, and ecosystem partners to deliver data center and connectivity solutions.
Senior Manager/Director, Hardware Engineering
- The Sr. Manager/Director of Hardware Engineering leads the hardware engineering organization within the business unit. This role is responsible for the architecture, design, development, validation, and production readiness of high-speed board-level hardware, reference designs, evaluation and validation platforms, and interconnect solutions that enable our analog ICs devices.
- The ideal candidate builds and leads a multi-disciplinary team focused on high-speed PCB design, signal integrity (SI), power integrity (PI), system bring-up, and characterization while driving close collaboration with IC design, validation, applications, product marketing, and customers.
Key Responsibilities:
- Define and execute the hardware engineering roadmap aligned with our product strategy for data center and optical/copper connectivity markets.
- Lead the design and development of complex interconnect solutions for internal hardware needs as well as for customer hardware reference designs.
- Oversee high-speed PCB architecture, schematic capture, layout, SI/PI analysis, and design for manufacturing (DFM).
- Drive rigorous board-level verification, bring-up, debug, and characterization using advanced lab equipment (VNA, TDR, high-speed oscilloscopes, BERTs, etc.).
- Establish and continuously improve design methodologies, simulation tool flows (HyperLynx, SIwave, HFSS, ADS, etc.), and measurement best practices.
- Build, mentor, and scale a high-performing team of hardware, SI/PI, and systems engineers; manage performance, career development, and technical excellence.
- Partner closely with IC design, packaging, applications engineering, validation engineering, test engineering, signal integrity engineering, product marketing, and operations to ensure seamless product integration and time-to-market.
- Engage directly with key customers and ecosystem partners on reference designs, technical requirements, and solution enablement.
- Manage project schedules, resources, budgets, and risk for multiple concurrent hardware programs from concept through production release.
- Champion design quality, reliability, EMI/EMC compliance, cost optimization and on time delivery
- Oversee interactions with external vendors and plan for fabrication and assembly of boards to meet demands.
Job requirements (Minimum qualifications and Previous Relevant Work Experience, Key competencies required):
- Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field (PhD a plus).
- 12+ years of progressive hardware engineering experience in high-speed digital, mixed-signal, or analog systems, with at least 3+ years in a management role.
- Deep expertise in high-speed PCB design, multi-layer stack-ups, differential signaling, SerDes interfaces (PCIe, Ethernet, PAM-4, etc.), signal integrity, and power integrity.
- Proven track record delivering complex hardware platforms from concept through volume production in data center, networking, optical modules, or similar environments.
- Hands-on experience with industry-standard EDA and SI tools (e.g., PADS/xDxDesigner, Allegro, HyperLynx, SIwave, HFSS, Keysight ADS) and high-speed lab instrumentation.
- Strong understanding of transmission line theory, impedance control, crosstalk, jitter, and high-speed link analysis.
- Demonstrated ability to lead cross-functional teams and influence technical direction in a fast-paced semiconductor environment.
- Excellent communication, collaboration, and stakeholder management skills.
- Familiarity with advanced packaging, thermal management, and high-density connector systems.
- Familiarity with lab equipment (multimeter, oscilloscopes, VNAs)
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