Design and validate high-speed packages, develop EDA tools and automation flows, model package structures, and ensure consistency in design processes.
Nokia Bell Labs is seeking a High-Speed Package Design Engineer to drive the design, simulation, and validation of advanced IC packages for high-performance RF, photonics, and mixed-signal systems.
This role focuses on end-to-end package design ownership, including architecture definition, SI/PI analysis, electromagnetic modeling, and measurement correlation, while working closely with silicon, PCB, and system integration teams. The successful candidate will also contribute to package design enablement through ADKs and reusable libraries, in close collaboration with leading EDA vendors. Package and system design leadership is the primary emphasis of this role.
This position is suitable for senior-level engineers who are comfortable taking ownership of complex package designs while influencing broader design flows and infrastructure.
Responsibilities- Lead the design and development of high-speed IC packages, including SiP, FC-BGA, and advanced heterogeneous integration solutions
- Define package architectures, stack-ups, routing strategies, and interconnect to meet SI/PI and RF requirements
- Perform 3D EM simulation and SI/PI analysis of package transitions, passive components, and die-to-package interfaces
- Co-optimize die, package, and PCB designs in collaboration with silicon, board, and system integration teams
- Correlate simulation results with laboratory measurements (e.g., VNA, TDR/TDT, high-speed oscilloscope)
- Contribute to the definition and evolution of package ADKs, reusable libraries, technology files, and verification flows, working in partnership with EDA vendors
- Provide technical input and design validation for vendor-supported automation and enablement efforts
- Support continuous improvement of package design methodologies and best practices across projects
Required Qualifications
- MS or PhD in Electrical Engineering, Applied Physics, or equivalent relevant industry experience
- 5+ years of hands-on experience in IC package design for high-speed, RF, or mixed-signal applications
- Strong fundamentals in electromagnetics, signal integrity, and power integrity
- Experience with 3D EM and package design tools (e.g., HFSS, CST, ADS, Allegro X APD, Xpedition, or equivalent)
- Ability to work independently and collaboratively in a cross-functional, research-driven environment
Preferred Qualifications
- Experience with advanced packaging technologies (chiplets, 2.5D/3D integration, interposers)
- Familiarity with ADKs, PDKs, or design enablement concepts, including collaboration with EDA vendors
- Working knowledge of Python and/or Tcl for design automation, simulation support, or data analysis
- PCB design and technology (e.g., Altium or equivalent)
Similar Jobs
Artificial Intelligence • Fintech • Insurance • Marketing Tech • Software • Analytics
Handles inbound calls and warm leads to consult customers on insurance needs, recommend appropriate property and casualty coverage, and convert prospects into policyholders. The role includes paid licensing and sales training, customer communication, lead conversion, schedule flexibility, and remote work requiring a dedicated workspace and reliable wired internet.
Top Skills:
Cable InternetDsl InternetFiber InternetPcWired High-Speed Internet
Insurance • Financial Services
Provides bilingual Spanish-English customer support through phone, email, and written correspondence. Resolves inquiries accurately, handles escalations, meets quality and service-level metrics, and contributes to department initiatives. The role requires strong communication, listening, problem-solving, computer, and customer service skills, along with schedule flexibility, shift work, and occasional overtime. This is a remote, Monday-through-Friday position.
Top Skills:
ExcelMicrosoft Office SuiteMicrosoft OutlookMicrosoft Word
Healthtech • Logistics • Pharmaceutical
Assists with developing, testing, documenting, and deploying SCADA visualization solutions. Supports SCADA client and server display programming, PLC function block programming, process control system modifications, infrastructure documentation, training guides, requirements gathering, design activities, and project updates.
Top Skills:
Allen-BradleyHTMLJavaPlcPythonScadaSiemensSQLSvg
What you need to know about the San Francisco Tech Scene
San Francisco and the surrounding Bay Area attracts more startup funding than any other region in the world. Home to Stanford University and UC Berkeley, leading VC firms and several of the world’s most valuable companies, the Bay Area is the place to go for anyone looking to make it big in the tech industry. That said, San Francisco has a lot to offer beyond technology thanks to a thriving art and music scene, excellent food and a short drive to several of the country’s most beautiful recreational areas.
Key Facts About San Francisco Tech
- Number of Tech Workers: 365,500; 13.9% of overall workforce (2024 CompTIA survey)
- Major Tech Employers: Google, Apple, Salesforce, Meta
- Key Industries: Artificial intelligence, cloud computing, fintech, consumer technology, software
- Funding Landscape: $50.5 billion in venture capital funding in 2024 (Pitchbook)
- Notable Investors: Sequoia Capital, Andreessen Horowitz, Bessemer Venture Partners, Greylock Partners, Khosla Ventures, Kleiner Perkins
- Research Centers and Universities: Stanford University; University of California, Berkeley; University of San Francisco; Santa Clara University; Ames Research Center; Center for AI Safety; California Institute for Regenerative Medicine
