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Nokia

Photonic Integrated Circuit (PIC) Design Engineer

Reposted 15 Days Ago
Be an Early Applicant
Remote or Hybrid
2 Locations
Mid level
Remote or Hybrid
2 Locations
Mid level
Develop next-generation InP Photonic Integrated Circuits for telecom and datacenters. Responsibilities include design, simulation, testing, and fabrication process development.
The summary above was generated by AI

We are developing next-generation coherent telecom and intra-datacenter InP Photonic Integrated Circuits powering optical interconnections.  We need motivated engineers and scientists to spearhead developing new products. 

A range of experience is needed for numerous openings:  Ph.D. in Electrical Engineering, Physics or Solid State Physics, including new graduates through industry veterans will be considered for various roles up to and including leadership. 

NION2026

Responsibilities
  • Key experience should include 1 or more areas 

  •  

    • Design of high-speed Mach-Zehnder Modulator or Electro-Absorption Modulator 

    • Design of high-power or telecom/datacom/datacenter InP lasers (C- or O-band) 

    • Design of photonic integrated circuits, especially including InP materials 

Qualifications
  • Key engineering expertise in several of the following areas required 


  • Design and simulation of photonic devices 

  • Process design/fabrication process development of InP devices or PICs 

  • Photonic device testing of high-speed modulators 

  • RF signal integrity design and simulation 

  • PIC/driver co-design 

  • Extensive photonic device data analysis in manufacturing environment 

  • PIC mask layout design expertise with 10 or more layers 

  • Extensive characterization of semiconductor laser diodes 

 

#OMG

 

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