Principal Application Engineer Lead (Semiconductor HW & SW)

Principal Application Engineer Lead (Semiconductor HW & SW)

Summary:

• You will support Ethernovia’s field team and local customers developing next-generation Automotive, Robotics, and Physical AI platforms to help integrate Ethernovia’s high-performance Ethernet solutions into advanced hardware & software systems. This is a Hybrid-based position based in San Jose, CA.

Key Responsibilities:

• Interface between Ethernovia’s field team and engineering teams, you will bring strong technical competence and the ability to communicate effectively across our multinational teams
• Work closely with field application and business development teams around the world along with internal hardware, software and architecture teams, to support customer designs from early concept and development through validation and production.
• Hands-on role that requires strong problem-solving skills and the ability to operate across fast-moving technical programs
• Work directly with customer engineering teams and the field teams on complex system integration challenges involving high-speed networking, sensor connectivity, AI compute platforms and robotics architectures.
• Day-to-day activities include;
  • Creating design collateral
  • Close collaboration with system and engineering teams
  • Technical customer support and system bring-up
  • Debugging to support integration efforts across Automotive and Robotics applications including sensor fusion and autonomous systems and AI-driven platforms

Required Experience & Skills:

• Semiconductor Industry: 10+ years of embedded development experience with focus on both hardware and software
• Hands-on design experience with at least one of the following:
  • Ethernet PHYs
  • Ethernet switches
  • PCIe 
• Ability to diagnose and debug problems effectively
• Excellent team working abilities across global teams and confident interacting with engineers through to executive management
• Automotive experience at Tier 1, Tier 2 or OEM level
• B.S. or M.S. in Electrical Engineering

Nice to Have (The "Competitive Advantage"):

• Good understanding of embedded software drivers
• Understanding and experience of OSI network layers 2+
• Experience of Ethernet switches and understanding of IEEE802.1 protocols
• Experience with TSN protocols
• Experience with PCIe protocols and topologies
• Experience covering high speed PCB board design, layout and routing constraints
• Experience with ROS / ROS2, Isaac Sim, CUDA, etc

Personal Skills:

• Excellent communication/documentation skills
• Attention to details
• Collaboration across multidisciplinary and international teams
• Self-motivated and able to work effectively both independently and in a team

What You Can Expect From Ethernovia:

• Technology depth and breadth expansion that can’t be found in a large company
• Opportunity to grow your career as the company grows
• Pre IPO stock options
• Cutting edge technology
• World class team
• Competitive base salary
• Flexible hours
• Medical, dental and vision insurance for employees

Salary Range:

• The actual offered base salary for U.S. locations will vary depending on factors such as work location, individual qualifications, specializations, years of experience, skills, job-related knowledge, and internal equity. The annual salary range for this position is $180,000 - $240,000. The compensation package will also include incentive compensation in the form of pre-IPO ISO options, as well as eligibility for performance bonuses, in addition to base salary and a full range of medical and other benefits.

* Principals Only (No Agencies)

#LI-Hybrid