Sr Manager Hardware Engineering Analysis

You will architect and optimize the core of our cutting-edge semiconductor products, overseeing a team of experts specializing in Thermo-mechanical design. This critical role demands a seasoned leader experience managing complex analysis functions, responsible for establishing state-of-the-art simulation methodologies, ensuring error-free tape-outs and driving innovation that directly influences our technology roadmap and competitive edge. If you possess a deep understanding of advanced 2D/2.5D & 3D packaging, excel in managing people and vendor relationships, and are eager to define the future of technology 

Responsibilities

• Lead and manage a cross-disciplinary team of 6- 8 engineers with expertise across thermal & thermo-mechanical analysis, and mechanical design domains 
• Develop and implement state-of-the-art analysis techniques to provide accurate, predictable, and high-confidence thermal and thermo-mechanical analysis. This encompasses photonic and electronic chips (PIC, EIC), advanced 2.5D and 3D Co-Packaged Optics (CPO) packages, and the complex interactions within these systems
• Develop validation techniques and drive appropriate data collection activities (in-house and in collaboration with external labs) to deliver high confidence in analysis outcomes
• Participate in design reviews at program levels and publish documents to support evidence-based indicators of risk levels at each program level milestone
• Establish and evaluate group accomplishments against defined objectives and key results
• Maintain and develop capabilities by recruiting appropriate talent and continuing to review employee’s skill set requirements & training to meet business needs.
• Ensure a safe, secure, and legal work environment
• Responsible for employee performance management and development

Qualifications

• MS or PhD in Mechanical Engineering, or a closely related field is required
• A minimum of 8+ years of demonstrated domain expertise in Thermal and Mechanical Design, including proficiency in simulation techniques such as Finite Element Analysis, is essential
• At least 5 years of verifiable experience in leading and managing a multi-physics engineering analysis team is necessary
• Expertise in the development of advanced (2.5D, 3D, CPO) package assembly and test processes, with a proven ability to address reliability challenges through rigorous analysis, design of experiments and guiding failure analysis.
• Proficient in lab-scale validation techniques, material characterization and expertise in the use of simulation or MCAD tools such as Solidwork, Ansys, or Flotherm
• Extensive experience in collaborating with external vendors and suppliers is required
• A solid understanding of software tools and requisite IT infrastructure is preferred

Preferred Qualifications

• Knowledge of EDA tools such as Mentor Graphics, Allegro 
• Ability to work independently, lead a team, and manage multiple projects simultaneously
• Strong communication skills and a track record of successful collaboration in cross-functional team environments
• Creative thinker with strong problem solving skills