Mechanical Engineer – SoC to Rack Integration

We are seeking a Principal Mechanical Engineer to lead the hardware definition of our next-generation AI infrastructure. This is a high-impact individual contributor role where you will serve as the primary technical authority for the physical architecture of advanced server platforms. You will bridge the critical gap between ultra-high-power silicon packaging, liquid-cooled node design, and massive-scale rack deployments.

Key Responsibilities

• Blade & Chassis Design: Lead the end-to-end mechanical definition of server blades, high-density chassis, and rack-level enclosures.
• Structural Hardware: Architect the integration of sliding rails, blind-mate connectors, precision standoffs, and high-load extraction handles.
• Power & Interconnects: Define mechanical paths for ultra-high-density power delivery busbars and complex cable management systems.
• Cold Plate & Fluid Management: Own mechanical integration of liquid cooling systems, providing design feedback on cold plate layouts, manifold distribution, and QD/leak-mitigation compatibility.
• Thermal Strategy: Support hybrid air/liquid cooling solutions for 1kW+ nodes, collaborating with thermal specialists on CFD-informed design decisions.
• HVM Optimization: Optimize designs for high-volume manufacturing using precision milling, die casting, and complex sheet metal fabrication.
• Environmental Ruggedization: Ensure system integrity against transportation shock and vibration and extreme thermal and humidity cycling.
• Lifecycle Design: Implement Design for Cost (DfC) and Design for Assembly (DFA) principles to ensure seamless serviceability and global deployment readiness.

Required Qualifications

• B.S. or M.S. in Mechanical Engineering.
• Design Experience: 12+ years in design and validation (MDVT) of modular electromechanical chassis and rack level systems in data centers for HPC/AI/Enterprise segment.
• Proven track record of owning at least one full product lifecycle — from concept through high-volume manufacturing (HVM).
• Expert-level understanding of metal fabrication processes including milling, casting, and sheet metal, and how they impact thermal performance and structural integrity.
• Technical knowledge of fluid dynamics, wetted material compatibility, and the mechanical nuances of drip-free connector integration.
• Proficiency in FEA tools for structural and vibration analysis.
• Demonstrated ability to drive technical alignment across silicon, power, and optical engineering teams.

Preferred Qualifications

• Direct experience with AI/GPU-based architectures and ultra-high-density power delivery systems.
• Deep familiarity with Open Compute Project (OCP) or ORV3 standards.
• Experience with blind-mate liquid and power interfaces.