Senior Mechanical Engineer

Eridu AI is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate training and inference for large-scale AI models. Today’s AI performance is frequently limited by system-level bottlenecks. Eridu AI delivers multiple industry-first innovations across semiconductors, software, and systems to unlock greater GPU utilization, reduce capital and power costs, and maximize data center efficiency. The company’s solutions and value proposition have been validated by several leading hyperscalers.

The company is led by a veteran team of Silicon Valley executives and engineers with decades of experience in state-of-the-art semiconductors, optics, software, and systems, including serial entrepreneur Drew Perkins, co-founder of Infinera (NASDAQ: INFN), Lightera (acq. by Ciena), Gainspeed (acq. by Nokia) and Mojo Vision (World’s leading micro-LED company and developer of the first augmented reality contact lens).

We are seeking an innovative and experienced Senior Mechanical Engineer to lead the design, integration, and validation of mechanical systems and advanced packaging for high-performance computing and communication hardware. This role requires a strong foundation in mechanical design, DFM, and system-level integration, as well as the ability to drive innovation in liquid cooling, IC packaging, and manufacturing processes.

• Mechanical Design: Design and optimize chassis, enclosures, cold plates, and mounting structures for rack-mounted systems, ensuring performance, structural integrity, thermal efficiency, and manufacturability.
• Packaging Design: Develop mechanical designs for IC and optical packages, including advanced packaging technologies (2.5D, 3D, SMT, solder ball attach) and novel cooling approaches. Photonics integration experience is a strong plus.
• Material Selection: Select materials based on thermal, mechanical, and electrical properties to meet reliability and performance goals. Collaborate with silicon, system, and packaging teams internally and externally (ODMs, OSATs, design houses).
• Prototyping & Testing: Build and test mechanical and packaging prototypes. Conduct validation testing (thermal cycling, shock, vibration) and iterate on design improvements.
• Cross-Functional Collaboration: Partner with electrical, thermal, and manufacturing engineers to integrate electrical/optical components into product designs and ensure functional compatibility.
• Design for Manufacturing & Root Cause Analysis: Apply DFM principles early in the design cycle. Lead FMEA, conduct root cause investigations, and resolve reliability and yield challenges.
• Documentation & Communication: Develop comprehensive documentation, including specifications, test plans, design reports, and manufacturing drawings. Present designs and findings to technical and non-technical stakeholders.
• Quality Assurance: Ensure compliance with industry standards and implement QA processes throughout the design and development lifecycle.

• Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, or a related field
• 5+ years of experience in mechanical and packaging design, with a proven track record of bringing products from concept to high-volume production
• Strong knowledge of mechanical design for electronics systems, including chassis, board-level components, and packaging for high-speed electrical and optical interconnects
• Expertise in Design for Manufacturability (DFM), Failure Mode and Effects Analysis (FMEA), and root cause analysis methodologies
• Proficiency in 3D CAD tools such as SolidWorks, Creo, or AutoCAD
• Strong written and verbal communication skills, with the ability to clearly document technical concepts and collaborate across cross-functional teams

• 10+ years of experience in mechanical design and packaging for computing or communication hardware systems
• Familiarity with 2.5D/3D IC packaging, photonics integration, and substrate-level mechanical design
• Experience collaborating with ODMs, OSATs, and contract manufacturers to define manufacturing processes and solve DFM challenges
• Demonstrated innovation in mechanical architecture, system packaging, or high-density electronics integration
• Experience with advanced thermal solutions including cold plates, manifolds, and CDUs for liquid cooling is a plus
• Experience in simulation tools such as Ansys Mechanical, Icepak, or Flotherm is a plus
• Experience with quality and statistical analysis tools such as JMP is a plus

At Eridu AI, you’ll have the opportunity to shape the future of AI infrastructure, working with a world-class team on groundbreaking technology that pushes the boundaries of AI performance. Your contributions will directly impact the next generation of AI networking solutions, transforming data center capabilities. 

The starting base salary for the selected candidate will be established based on their relevant skills, experience, qualifications, work location, market trends, and the compensation of employees in comparable roles.