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Broadcom

Package Design Engineer

Posted 5 Days Ago
Be an Early Applicant
In-Office
San Jose, CA, USA
83K-132K Annually
Junior
In-Office
San Jose, CA, USA
83K-132K Annually
Junior
Designs complex flip-chip BGA packages for high-performance ASICs used in AI, networking, HPC, and 5G applications. Responsibilities include package layout, signal and power integrity, thermal and reliability considerations, manufacturability, and design of SerDes, ADC/DAC, DDR, and related structures. The engineer manages multiple projects, collaborates with global teams and vendors, interfaces with customers, and improves design processes through automation and documentation. This is a fully onsite role.
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Job Description:

Broadcom is seeking an IC package-design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and very-high-power delivery needs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 224G and higher, 5G RF/Microwave ADC/DAC, HBM, DDR5 and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design, and contribute to efficiency improvements for our design team.

RESPONSIBILITIES:

  • Overall design responsibility for ASIC package designs, including aspects of signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts.

  • Package Design of critical structures for SerDes, ADC/DAC, DDR, etc.

  • Schedule, prioritize, & track your work across 2+ projects simultaneously

  • General flip-chip BGA package design & engineering

  • Project management and customer interface for your design projects

  • Contribute to efficiency improvements for the design team, through process development/improvement, automation, documentation, etc.

  • Physical design (layout) is a foundational responsibility in this role

 
EDUCATION/EXPERIENCE & REQUIREMENTS:

  • BSEE or similar field and 2+ years’ experience in flip-chip-BGA package design, including high-speed SerDes or MSEE or PhD

  • Knowledge of electrical engineering fundamentals

  • Preferred candidates have a working knowledge of package-level signal integrity and power integrity, to apply to package designs

  • Cadence APD (allegro package designer) experience is preferred. Equivalent layout tool is OK.

  • Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

  • Self-management and organization skills

  • Preferred candidates will also have 1 or more years experience with Cadence SKILL for Allegro, or similar design-automation coding experience and interest

OTHER REQUIREMENTS

  • This job requires working on-site at the Broadcom office, 5 days a week. This is not a remote-work position.


Compensation and Benefits


The annual base salary range for this position is USD 82,500.00 To USD 132,000.00

As a valued member of our team, you'll be eligible for a discretionary annual bonus and the opportunity to receive not only a competitive new hire equity grant, but also annual equity awards, connecting your success directly to the company's growth. All subject to relevant plan documents and award agreements.


Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.


Broadcom is proud to be an equal opportunity employer.  We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law.  We will also consider qualified applicants with arrest and conviction records consistent with local law.


If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

HQ

Broadcom Palo Alto, California, USA Office

Palo Alto, CA, United States

Broadcom Richmond, California, USA Office

13711 International Pl Unit 200, Richmond, British Columbia, V6V 2Z8, Canada, Richmond, Canada, V6V 2Z8

Broadcom San Francisco, California, USA Office

San Francisco, United States, 0

Broadcom San Jose, California, USA Office

1320 Ridder Park Drive, San Jose, CA, United States, 95131

Broadcom Santa Clara, California, USA Office

Santa Clara, United States, 0

Broadcom Sunnyvale, California, USA Office

190 Mathilda Pl, Sunnyvale, California, 94086-6076, United States, Sunnyvale, United States, 94086-6076

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