Assure quality across automotive IC product development, manufacturing, release, servicing, and customer support. Lead quality improvement, Safe Launch, high-voltage stress testing, yield analysis, FMEA, failure analysis, customer complaint investigations, and CAPA. Use semiconductor testing and microscopy tools to identify root causes, coordinate corrective actions with engineering teams, customers, suppliers, package houses, and foundries, and support multi-region camera module manufacturing sites.
Job Title: Quality Engineer
Job Duties:
- Assure quality throughout the product lifecycle, including product development, manufacturing, failure analysis, production release, and servicing.
- Plan and execute quality strategies during the design and development phases by defining standard operating procedures for electrical quality control and assurance, ensuring that risks are mitigated and issues are promptly corrected during ramp-up.
- Lead automotive quality improvement initiatives by implementing proactive measures to reduce test-related quality incidents, driving cross-department Lessons Learned activities for manufacturing and test items, improving outgoing electrical quality control processes, and managing Safe Launch and High Voltage Stress Testing for automotive products.
- Ensure product quality and reliability through statistical yield analysis techniques such as and Statistical Yield and Bin Limit (SYL, SBL) evaluations.
- Perform failure analysis utilizing pFA and eFA tools — including cross-sectioning, emission microscopy, X-ray analysis, SEM (Scanning Electron Microscope), optical microscopy, oscilloscope probing, and OBIRCH — to identify failure modes, localize physical hot spots, and determine root causes.
- Conduct FMEA (Failure Mode and Effect Analysis) and statistical data analysis — such as box plots, histograms, distributions, scatter charts, normalization, and linearity — using MATLAB, Visual C, Excel, and internal OVT tools for reliability and yield assessments.
- Handle customer complaint (CCN) cases and customer return analyses, providing detailed failure reports and coordinating with cross-functional teams to identify root causes and implement corrective actions.
- Communicate directly with end customers and supply chain partners, including package houses and foundries (e.g., TSMC), to resolve quality and process issues identified during IC manufacturing. Apply IC fabrication knowledge to evaluate wafer- or process-related deviations.
- Provide remote support for customers with multi-region manufacturing sites producing camera modules and related automotive imaging products.
- Drive Corrective and Preventive Actions (CAPA) across functional engineering teams to ensure continuous improvement, enhance product robustness, and maintain stable production quality.
Requirements:
Require Master’s degree or foreign equivalent degree in Electrical Engineering, Computer Engineering, or a related field.
Must acquire the following knowledge and/or skills from the graduate level course study:
- Digital IC design
- IC fabrication
- C programming
- RTL design
- VHDL programming
- Verilog programming
- Semiconductor physics
- Reliability prediction
Annual base salary for this role in California, US is expected to be between $120,182 - $125,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
OMNIVISION Santa Clara, California, USA Office
4275 Burton Dr, Santa Clara, California, United States, 95054 1512
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