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Hewlett Packard Enterprise

Senior Principal Thermal Engineer

Posted An Hour Ago
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In-Office
Sunnyvale, CA, USA
181K-367K Annually
Senior level
In-Office
Sunnyvale, CA, USA
181K-367K Annually
Senior level
Leads HPE’s long-term thermal technology strategy for networking, AI, compute, and data-center hardware. Defines architectures, standards, modeling practices, validation frameworks, and innovation roadmaps spanning air, liquid, hybrid, immersion, and emerging cooling technologies. Conducts feasibility studies, simulations, benchmarking, and technology assessments; advises on product architecture and tradeoffs; evaluates suppliers and partners; influences executives and industry groups; and mentors thermal engineers. The role requires deep expertise in heat transfer, fluid mechanics, electronics cooling, CFD, and high-density computing infrastructure.
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Senior Principal Thermal Engineer

  

This role has been designed as ‘’Onsite’ with an expectation that you will primarily work from an HPE office.

Who We Are:

Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE.

Job Description:

   

HPE is seeking a Senior Principal Thermal Engineer who is a recognized authority in advanced thermal management technologies for high-performance networking, AI, compute, and data-center hardware. This role will define and drive the future thermal technology vision, architectures, methodologies, and innovation roadmaps spanning advanced air cooling, liquid cooling, hybrid cooling, and emerging thermal solutions. The engineer will identify, evaluate, and mature next-generation cooling technologies, guide long-term platform strategies, influence industry direction, and solve critical business and customer challenges. Through deep technical leadership and innovation, this individual will deliver substantial, long-lasting impact in performance, reliability, energy efficiency, sustainability, cost optimization, and product differentiation. The successful candidate will influence executive and cross-functional decisions, shape technology investments, collaborate with industry partners and suppliers, contribute to standards development, mentor engineers, and strengthen HPE's technical community.

Detailed Job Description

 

Responsibilities

  • Define and drive the long-term thermal technology vision, strategy, and roadmap for HPE Networking products spanning advanced air cooling, liquid cooling, hybrid cooling, and emerging thermal management technologies.
  • Identify, evaluate, mature, and recommend next-generation cooling technologies required to support future AI, networking, high-performance compute, and data-center platforms.
  • Establish organization-wide thermal architectures, design methodologies, technology standards, modeling practices, and validation frameworks used across multiple business units and product generations.
  • Serve as the senior technical authority and thought leader for advanced thermal management technologies, including high-performance heat sinks, vapor chambers, heat pipes, fan and airflow systems, cold plates, manifold architectures, immersion cooling, coolant distribution systems, facility water integration, and emerging two-phase cooling solutions.
  • Lead early-stage technology investigations, proof-of-concept development, feasibility studies, competitive benchmarking, and technology readiness assessments to enable future product roadmaps.
  • Evaluate thermal implications of future silicon, optics, packaging, power delivery, rack-scale architectures, and AI infrastructure trends; develop cooling strategies that enable next-generation performance requirements.
  • Define technical requirements and assessment criteria for new cooling technologies, including thermal performance, airflow management, coolant flow distribution, reliability, energy efficiency, sustainability, serviceability, manufacturability, acoustic performance, and total cost of ownership.
  • Review critical product architectures and provide expert guidance on thermal design tradeoffs, risk mitigation strategies, and technology selection decisions.
  • Evaluate strategic suppliers, development partners, universities, startups, and technology providers to identify breakthrough innovations applicable to future HPE platforms.
  • Mentor thermal engineers across the organization and help develop the next generation of technical leaders within HPE.

Education and Experience Required

  • Bachelor's or Master's degree in Mechanical Engineering, Thermal Sciences, Aerospace Engineering, Physics, or a related engineering discipline; advanced degree preferred.
  • Typically 15+ years of experience in thermal engineering, electronics cooling, or related disciplines, including recognized expertise in advanced air-cooling and/or liquid-cooling technologies.
  • Demonstrated technical leadership and industry impact through development of innovative thermal solutions, advanced technology programs, major architecture contributions, or pioneering cooling technologies.
  • Proven ability to influence technology direction across organizations, business units, suppliers, customers, and industry groups.

Knowledge and Skills

  • Deep expertise in electronics thermal management technologies, including advanced air cooling, liquid cooling, hybrid cooling architectures, and emerging cooling technologies for networking, AI, compute, and data-center applications.
  • Expert understanding of heat transfer, fluid mechanics, thermodynamics, airflow optimization, heat sink design, vapor chambers, heat pipes, cold plates, heat exchangers, flow distribution, pressure drop, and thermal system optimization.
  • Advanced knowledge of air-cooled architectures, including system airflow management, fan technologies, acoustic optimization, thermal control strategies, and high-density electronics cooling.
  • Extensive experience with thermal and CFD simulation tools such as FloTHERM, FloEFD, Icepak, Star-CCM+, Macroflow, or equivalent platforms.
  • Strong understanding of technology readiness assessment, feasibility studies, experimental design, thermal characterization, and performance validation techniques.
  • Knowledge of future industry trends involving AI infrastructure, high-density networking systems, advanced semiconductor packaging, co-packaged optics, photonics, rack-scale architectures, and sustainable data-center technologies.
  • Outstanding analytical and creative problem-solving skills with the ability to identify disruptive technologies and translate them into strategic business value.
  • Strong business acumen and executive-level communication skills with the ability to influence stakeholders ranging from engineering teams to senior leadership and external partners.
  • Demonstrated record of innovation through patents, industry publications, conference presentations, standards participation, or successful deployment of differentiated cooling technologies.

Accessibility


HPE is committed to creating an inclusive and accessible workplace and encourages applications from all qualified individuals, including those with disabilities. If you believe you require accommodation during any stage of the application or interview process, please submit your request by completing our secure form linked here.


Note: This option is reserved for applicants needing assistance/reasonable accommodation related to a disability.

What We Can Offer You:

Health & Wellbeing

We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.

Personal & Professional Development

We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.

Unconditional Inclusion

We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

Let's Stay Connected:

Follow @HPECareers on Instagram to see the latest on people, culture and tech at HPE.

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Job:

Engineering

Job Level:

TCP_06

    

"The expected salary/wage range for this position is provided below. Actual offer may vary from this range based upon geographic location, work experience, education/training, and/or skill level.
– United States of America: Annual Salary USD 181,000 - 367,000 in California
The listed salary range reflects base salary. Variable incentives may also be offered."

Information about employee benefits offered in the US can be found at https://myhperewards.com/main/new-hire-enrollment.html

HPE is an Equal Employment Opportunity/ Veterans/Disabled/LGBT employer. We do not discriminate on the basis of race, gender, or any other protected category, and all decisions we make are made on the basis of qualifications, merit, and business need. Our goal is to be one global team that is representative of our customers, in an inclusive environment where we can continue to innovate and grow together. Please click here: Equal Employment Opportunity.

Hewlett Packard Enterprise is EEO Protected Veteran/ Individual with Disabilities.

   

HPE will comply with all applicable laws related to employer use of arrest and conviction records, including laws requiring employers to consider for employment qualified applicants with criminal histories.

   

Recruitment Fraud Alert

We have become aware of an increase in fraudulent recruitment activities in which individuals impersonate our company or authorized recruitment agencies to offer fake employment opportunities. These scams may occur through false websites, emails, social media, or chat-based applications and often aim to obtain personal information or money. Please note that Hewlett Packard Enterprise (HPE), its direct and indirect subsidiaries and affiliated companies, and its authorized recruitment agencies/vendors will never charge a candidate a registration fee, hiring fee, or any other fee in connection with its recruitment and hiring process. We also never request personal information such as back account details, Social Security numbers, or national IDs via social media or chat applications.

All legitimate job opportunities will come through official company channels, and candidates are responsible for verifying the credentials of any third party claiming to represent the company. Any reliance on fraudulent communication is at the individual’s own risk, and HPE disclaims legal liability for any resulting damages. If you suspect recruitment fraud, do not share personal information or make any payments and report the incident to your local authorities immediately.

Hewlett Packard Enterprise San Jose, California, USA Office

San Jose, United States

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