Develop advanced CMOS and CIS process modules in collaboration with silicon, color, and package foundries. Support production and design teams by improving yield and sensor performance, analyze bench and wafer-level data, and manage silicon split lots according to project goals and schedules. The role applies device physics and process integration expertise to develop new image sensor technologies.
The Process Integration Engineer will use experience with device physics to develop advanced processes to their fullest extent, working in close collaboration with silicon and color foundries, image characterization, modeling and pixel design.
Responsibilities:
Responsibilities:
- Develops process modules to realize new CIS technologies
- Collaborates with foundry partners to define and improve the CIS silicon, color and package process for each CIS technology
- Provides support to production and design teams to improve yield and overall sensor performance
- Analyzes and interprets bench and wafer level data
- Designs and manages silicon split lots with respect to project goals and schedules
Qualifications:
- 2-10 yrs experience in Si based device technology (CMOS, CIS, etc), including developing advanced processes; CIS process experience is a plus (but not a requirement)
- Device physics background is desired.
- PhD or MS in Electrical Engineering or Physics.
Annual base salary for this role in California, US is expected to be between $120,600 - $160,000. Actual pay will be determined on a number of factors such as relevant skills and experience, and the pay of employees in the similar role.
EOE/Minorities/Females/Vet/Disability
EOE/Minorities/Females/Vet/Disability
OMNIVISION Santa Clara, California, USA Office
4275 Burton Dr, Santa Clara, California, United States, 95054 1512
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