Top Tech Jobs & Startup Jobs in San Francisco Bay Area, CA

Reposted 9 Hours AgoSaved
Remote
United States
100K-500K Annually
Entry level
100K-500K Annually
Entry level
Hardware • Manufacturing
The Performance Architect will work on high-performance systems with expertise in software and hardware, focusing on AI and HPC solutions.
Top Skills: Amba AxiAmba ChiC/C++CcixCxlDdrGddrLpddrPcieRisc-V
Reposted 9 Hours AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
As a Senior Chiplet Physical Design Engineer, you'll design and integrate chiplets into a System-in-Package, focusing on synthesis and place-and-route, while collaborating with global teams.
Top Skills: CadencePythonRisc-VSynopsysTcl
6 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead as a hybrid Chief of Staff and execution-focused TPM for the RISC-V software org: define goals, plan and track execution, manage dependencies and risks, drive cross-functional initiatives, support headcount and recruiting, prepare leadership materials, and represent the team to partners and customers.
Top Skills: CompilersEngineering InfrastructureRisc-VSemiconductorsSoftware DeliverySystems Software
9 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Design board-level routing studies, mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Collaborate with signal integrity, power integrity, mechanical, and system teams to develop PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling. Apply engineering judgment to evaluate tradeoffs and improve workflows using automation and data analytics.
Top Skills: 2.5D PackagingBackside Power DeliveryBgaCadence Allegro Pcb DesignerChipletsIntegrated Voltage RegulatorsOff-Package MemoryOn-Package MemoryPackage Embedded PassivesPackage-Board Co-DesignPcb RoutingPower IntegritySignal Integrity
10 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Contract Technical Recruiter (12-month, hybrid in Austin) partnering with engineering leaders to source, attract, and hire AI/ML, systems software, and hardware engineering talent. Build hiring strategies, talent pipelines, and targeted sourcing campaigns, deliver a high-touch candidate experience, and share market intelligence to improve recruiting outcomes.
Top Skills: AICompilersMachine LearningNetworkingRisc-VSemiconductors
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12 Days AgoSaved
Remote
USA
100K-500K Annually
Expert/Leader
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.
Top Skills: AdcAmplifiersBias GeneratorsCtleDacDdrDe-EmphasisDfeDie-To-Die Chiplet PhyEda ToolsFinfetLdoOscillatorsPciePllRxSerdesSwitched-Cap CircuitsTxUsb
Reposted 12 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
Design and specify next-generation CPU networking for datacenter and automotive/robotics targets. Work at the intersection of NoC, performance modeling, and RTL to guide architecture, collaborate with hardware, software, and systems teams, and contribute to datacenter networking and early-stage automotive/robotics networking scoping and specifications.
Top Skills: Broadcom SueDie-To-Die InterfacesEthernetInfinibandNocNvlinkRdmaRisc-VRoceRtlUalink
Reposted 12 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
The CPU Core Unit Lead will develop next-generation CPU RTL, define microarchitecture specifications, oversee design quality, mentor junior engineers, and use AI tools to enhance design processes.
Top Skills: Ai ToolsRisc-VRtlVerilogVhdl
13 Days AgoSaved
Remote
USA
100K-500K Annually
Expert/Leader
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
Define architecture and micro-architecture specs for memory and I/O chiplets, evaluate next-generation memory technologies, develop performance and power modeling infrastructure, and collaborate with SoC, verification, physical design, packaging, systems teams and external partners to enable high-throughput, low-latency memory architectures.
Top Skills: 3D-StackingAdvanced PackagingChipletsCustom MemoryDdrDfiDie-To-Die InterfacesGddrHbmHdlI/O ProtocolsLpddrMemory IpsPerformance And Power SimulationRisc-VSocStorage
13 Days AgoSaved
Remote
USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead hardware-software co-design to enable AI/HPC and agentic AI stacks on RISC-V CPUs. Integrate and optimize low-level kernel infrastructure, runtimes, distributed execution, memory systems, and developer tools, collaborating with architects, compiler engineers, and kernel developers to meet performance targets.
Top Skills: Accelerator IntegrationAgentic Ai FrameworksAICC++Distributed Execution FrameworksGccHpcIsa ExtensionsLlkLlvmMicroarchitectureProfilingRisc-VRuntime OrchestrationVectorization
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