Top Tech Jobs & Startup Jobs in San Francisco Bay Area, CA

2 Hours AgoSaved
Remote
USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Build and operate AI inference deployments, write production code, debug full inference stack, collaborate with customers and engineering, and drive performance/observability improvements using Kubernetes, Helm, and LLM serving tools.
Top Skills: DynamoGrafanaHelmKubernetesLmcacheMooncakeNimOpentelemetryPrometheusRisc-VSglangVllm
Reposted 23 Hours AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead as a hybrid Chief of Staff and execution-focused TPM for the RISC-V software org: define goals, plan and track execution, manage dependencies and risks, drive cross-functional initiatives, support headcount and recruiting, prepare leadership materials, and represent the team to partners and customers.
Top Skills: CompilersEngineering InfrastructureRisc-VSemiconductorsSoftware DeliverySystems Software
Reposted 2 Days AgoSaved
Remote
USA
100K-500K Annually
Expert/Leader
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
Define and own chiplet-based compute platform architectures for high-performance RISC-V CPUs in SiP solutions. Lead design of PCIe, die-to-die connectivity, coherent fabrics, system management, and confidential computing subsystems. Collaborate with architecture, hardware, software, and external IP partners to deliver production-ready chiplet architectures and drive cross-functional execution.
Top Skills: AtsBootChi-C2CChipletCoherent FabricsConfidential ComputingCxl.MemDebugDie-To-Die ConnectivityIommuMsiPci Express Root ComplexPciePower ManagementPriRciepResetRisc-VSocSystem ManagementSystem-In-PackageTee-I/OVirtualization
Reposted 4 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Design board-level routing studies, mock-ups, and SI/PI modeling to support early-stage semiconductor package and package-board co-design. Collaborate with signal integrity, power integrity, mechanical, and system teams to develop PCB routing environments for BGA optimization, package escape studies, and system-level electrical modeling. Apply engineering judgment to evaluate tradeoffs and improve workflows using automation and data analytics.
Top Skills: 2.5D PackagingBackside Power DeliveryBgaCadence Allegro Pcb DesignerChipletsIntegrated Voltage RegulatorsOff-Package MemoryOn-Package MemoryPackage Embedded PassivesPackage-Board Co-DesignPcb RoutingPower IntegritySignal Integrity
Reposted 6 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
Design and specify next-generation CPU networking for datacenter and automotive/robotics targets. Work at the intersection of NoC, performance modeling, and RTL to guide architecture, collaborate with hardware, software, and systems teams, and contribute to datacenter networking and early-stage automotive/robotics networking scoping and specifications.
Top Skills: Broadcom SueDie-To-Die InterfacesEthernetInfinibandNocNvlinkRdmaRisc-VRoceRtlUalink
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Reposted 6 Days AgoSaved
Remote
United States
100K-500K Annually
Mid level
100K-500K Annually
Mid level
Hardware • Manufacturing
The CPU Core Unit Lead will develop next-generation CPU RTL, define microarchitecture specifications, oversee design quality, mentor junior engineers, and use AI tools to enhance design processes.
Top Skills: Ai ToolsRisc-VRtlVerilogVhdl
Reposted 6 Days AgoSaved
Remote
USA
100K-500K Annually
Expert/Leader
100K-500K Annually
Expert/Leader
Hardware • Manufacturing
Design and deliver die-to-die chiplet PHY IP in advanced FinFET nodes: develop PLLs and AMS blocks, lead design verification and layout interactions, support tape-out and silicon bring-up, and collaborate across architecture, digital, verification, layout, and software teams to achieve production-quality silicon.
Top Skills: AdcAmplifiersBias GeneratorsCtleDacDdrDe-EmphasisDfeDie-To-Die Chiplet PhyEda ToolsFinfetLdoOscillatorsPciePllRxSerdesSwitched-Cap CircuitsTxUsb
7 Days AgoSaved
Remote
United States
Senior level
Senior level
Hardware • Manufacturing
Build and run an enterprise sales motion for AI hardware and software: own accounts through the full lifecycle, align technical solutions to business value, collaborate cross-functionally, develop repeatable processes and materials, and manage long, complex procurement cycles to accelerate revenue.
Top Skills: AIRisc-VSalesforce (Sfdc)Semiconductors
Reposted 8 Days AgoSaved
Remote
USA
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead hardware-software co-design to enable AI/HPC and agentic AI stacks on RISC-V CPUs. Integrate and optimize low-level kernel infrastructure, runtimes, distributed execution, memory systems, and developer tools, collaborating with architects, compiler engineers, and kernel developers to meet performance targets.
Top Skills: Accelerator IntegrationAgentic Ai FrameworksAICC++Distributed Execution FrameworksGccHpcIsa ExtensionsLlkLlvmMicroarchitectureProfilingRisc-VRuntime OrchestrationVectorization
Reposted 10 Days AgoSaved
Remote
United States
100K-500K Annually
Senior level
100K-500K Annually
Senior level
Hardware • Manufacturing
Lead and enhance global People Operations, focusing on employee lifecycle management, operational excellence, and compliance across multiple regions.
Top Skills: AIAutomation ToolsHris Platforms Such As RipplingJIRAWorkdayWorkflow Tools
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